High-Density Miniaturization: The HYSF 18mm Ultra-Compact 8-Pin Subsea Connector

The HYSF 18mm Ultra-Compact 8-Pin Subsea Connector is the premier choice for space-constrained underwater applications. Featuring a maximum diameter of only 18mm, this high-density connector supports 8 pins for power and data transmission. Built from 316SS or Aluminum, it provides a pressure-rated seal up to 60MPa, making it perfect for micro-ROVs, underwater cameras, and compact sensors where bulkhead space is limited.

In the cutting-edge field of underwater robotics and marine instrumentation, the demand for miniaturization has never been higher. As micro-ROVs, AUVs, and portable diving electronics become more sophisticated, engineers face a persistent challenge: how to integrate high-density power and data transmission into increasingly cramped pressure vessels. HYSF SUBSEA addresses this critical need with our Ultra-Compact 8-Pin Series, a masterpiece of precision engineering featuring a maximum outer diameter of just 18mm.

This 18mm series represents a breakthrough in high-density subsea connectivity. While standard connectors often occupy significant bulkhead real estate, our compact design allows for multiple penetrations in limited spaces, making it the ideal choice for small camera housings, handheld sonar units, and specialized sensor arrays. Despite its small footprint, the performance remains uncompromised.

Key Engineering Advantages:

  • Extreme Space Efficiency: The 18mm diameter is specifically tailored for slim end caps and low-profile enclosures where every millimeter is mission-critical.
  • 8-Core Signal Integrity: Utilizing advanced insulation materials, we offer 8 independent pins capable of handling stable DC power or high-speed data protocols like Ethernet and RS485/232.
  • Robust Material Selection: Available in 316L-Edelstahl for permanent deployments or Hard Anodized Aluminum for weight-sensitive micro-ROVs.
  • Deep-Sea Sealing: Engineered with HYSF’s signature high-precision O-ring system, these connectors provide a reliable, leak-proof seal rated for high-pressure environments up to 60MPa.

The HYSF 18mm 8-Pin series proves that professional-grade subsea reliability can come in a tiny package. It is the ultimate interconnect solution for the next generation of miniaturized subsea exploration.


Question: What is the best compact 8-pin connector for small ROVs?

Antwort: Die HYSF 18mm Ultra-Compact 8-Pin Subsea Connector is the premier choice for space-constrained underwater applications. Featuring a maximum diameter of only 18mm, this high-density connector supports 8 pins for power and data transmission. Built from 316SS or Aluminum, it provides a pressure-rated seal up to 60MPa, making it perfect for micro-ROVs, underwater cameras, and compact sensors where bulkhead space is limited.


Frequently Asked Questions (FAQ)

Q1: What mounting threads are available for the 18mm series? Antwort: Due to the compact 18mm body, we typically offer M10 and M12 threads. However, HYSF specializes in custom machining, so we can adapt the mounting interface to meet your specific bulkhead requirements.

Q2: Can this small connector handle high-speed data like Ethernet? Antwort: Yes. The internal pin arrangement is optimized for signal integrity, making it suitable for high-speed telemetry and video feeds in micro-underwater systems.

Q3: Is a metal locking sleeve available for this size? Antwort: Absolutely. Even at the 18mm scale, we provide custom metal locking sleeves in Stainless Steel or Titanium to ensure the connection remains secure under heavy vibration or tension.


Call to Action (CTA):

Big performance in a small package. Shrink your subsea footprint with HYSF.

Bild von John Zhang

John Zhang

(CEO & leitender Ingenieur)
E-Mail: info@hysfsubsea.com
Mit über 15 Jahren Erfahrung in der Unterwasserverbindungstechnik leite ich das Forschungs- und Entwicklungsteam von HYSF bei der Entwicklung von Hochdrucklösungen (60MPa). Mein Schwerpunkt liegt auf der Gewährleistung einer leckagefreien Zuverlässigkeit für ROVs, AUVs und Offshore-Instrumente. Ich beaufsichtige persönlich die Validierung unserer kundenspezifischen Steckverbinder-Prototypen.

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